Doubled-sided lapping and polishing machine handling 2" to 6" sapphire wafers.
Systems for High-Intensity LEDs
Material/substrate process
Double-sided lapping/polishing machine
LED wafer process
High-speed film thickness / PL measuring instrument
LED chip process
Fully automatic laser scriber for high-brightness LEDs
Fully automatic laser processing machine achieving high productivity
Chip luminance sorting machine
With a mini-sized integrating sphere, data correlation has improved greatly, achieving high-precision sorting.
LED package process
fully automatic high-speed die bonder for high-intensity LED PKGs
